Loading contract…
BETAThis is a new independent transparency project, not an official government website. The data is sourced from public registers and may contain errors, so always verify against the official source. If you find a problem, please report it here.
Argon-based magnetron sputtering system for sequential deposition of metals. The deposition should be made with a direct current method over up to 4” wafer area. The deposition should also be conformal to features present on the wafers. The ideal system will be employed for academic research and located within a cleanroom micro-fabrication facility.
No supplier information available.
This procurement was divided into 1 lots, each awarded separately.
| Lot | Value | Status |
|---|---|---|
| Lot 1 | - | planned |