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This Procurement shall cover the supply, delivery and installation of specific equipment that is suitable for the detailed inspection of a range of components used in advanced power electronics compound semi-conductor packaging, both at a piece part level and an assembly level. A semi-auto wafer mounter/de-mount is required for mounting wafers (up to 12") onto taped frames (carriers) for use in dicing and die attach machines
| Supplier | Identifier | Award Value | Lots Won | Cross-References |
|---|---|---|---|---|
| Inseto (UK) Limited | 02096377 | - | 1 lot Lot 1 | - |
This procurement was divided into 1 lots, each awarded separately. 2 bids were received in total.
| Lot | Value | Bids Received | Awarded To | Status |
|---|---|---|---|---|
| Lot 1 | - | 2 | Inseto (UK) Limited | complete |
Government spending data: This supplier has received £255,293 in 7 payments (over £25k) from UKRI (2023-02-24 to 2023-05-11). View full payment history →