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NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support a laser depanelling and singulation capability along with any and all associated ancillaries required.
No supplier information available.
This procurement was divided into 1 lots, each awarded separately.
| Lot | Value | Status |
|---|---|---|
| Lot 1 | - | planned |