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Tenders should demonstrate that the supplier possesses a comprehensive process library and clearly show the ability to cut glass, quartz, sapphire, silicon and SiC substrates.
Tenders should address how a 1 mm thick, 150 mm square glass substrates can be diced.
| Supplier | Identifier | Award Value | Lots Won | Cross-References |
|---|---|---|---|---|
| DISCO HI-TEC EUROPE GmbH | - | - | 1 lot Lot 1 | - |
This procurement was divided into 1 lots, each awarded separately. 3 bids were received in total.
| Lot | Value | Bids Received | Awarded To | Status |
|---|---|---|---|---|
| Lot 1 | £67,000 initial term | 3 | DISCO HI-TEC EUROPE GmbH | complete |