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The Department of Physics at the University of Strathclyde requires a wafer dicing saw. The wafer dicing saw will be used primarily for dicing 150 mm diameter wafer stacks of glass and silicon.
| Supplier | Identifier | Award Value | Lots Won | Cross-References |
|---|---|---|---|---|
| Disco Hi-Tech UK Ltd | - | - | 1 lot Lot 1 | - |
This procurement was divided into 1 lots, each awarded separately. 1 bids were received in total.
| Lot | Value | Bids Received | Awarded To | Status |
|---|---|---|---|---|
| Lot 1 | £57,000 initial term | 1 single bid — no competition | Disco Hi-Tech UK Ltd | complete |