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Sub-Micron Die Bonder — UNIVERSITY OF SHEFFIELD | UKGovscan

PIPELINEPreliminary market engagement notice (UK2) · UNIVERSITY OF SHEFFIELDRef ocds-h6vhtk-05f213

Sub-Micron Die Bonder

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Contract Value

Not specified

· Above the relevant threshold

Source

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View original notice

A planning notice whose dates have passed. Look for the tender or award notice that followed it. The tender notice was expected on 16 December 2025.

Description

We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems.

Buyer

Organisation: UNIVERSITY OF SHEFFIELD
Buyer ID: GB-COH-RC000667
Local Authority Code: –
Address: Firth Court, Western Bank, Sheffield, S10 2TN, United Kingdom
Website: https://www.sheffield.ac.uk/
Type of body: Public authority - sub-central government

Suppliers

No supplier information available.

Lots

This procurement was divided into 1 lots, each awarded separately.

Lots

Lot	Value	Status
Lot 1 Mar 2026 – Mar 2026	-	planning

Key Dates

Published: 9 December 2025
Tender Open: -
Tender Deadline: -
Award Date: -
Contract Start: -
Contract End: -
Planned term: 2 March 2026 – 31 March 2026

Procurement Details

Method: –
Method Details: –
Main category: Goods
Category: Laboratory, optical and precision equipments (excl. glasses)
Delivery location: UKE32
Buyer Reference: 4915/DM/25
Legal Basis: Procurement Act 2023
CPV Codes: 38000000 – Laboratory, optical and precision equipments (excl. glasses)

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