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As part of the existing Technology Development Element (TDE) contract with the European Space Agency (ESA), the Open University (OU), in company with Teledyne-e2v, are required to procure and test three experimental test chips for characterisation and testing.
Phase 1: To procure Silicon wafers for the manufacture of Front Side Illuminated (FSI) soft X-ray Complementary Metal Oxide Semiconductor (CMOS) imaging detectors to characterise their Electro Optical (EO) performance both pre and post irradiation.
Phase 2: A potential second phase subject to funding to process any remaining Silicon wafers from the first phase for the manufacture of Back Side Illuminated (BSI) soft X-ray CMOS imaging detectors to characterise their EO performance both pre and post irradiation.
Phase 3: A potential third phase subject to funding to procure Silicon wafers to manufacture another batch of either FSI or BSI soft X-ray CMOS imaging detectors for further characterisation of their EO performance both pre and post irradiation.
Cost
Phase 1: £220,000
Phase 2: £250,000
Phase 3: £350,00
Total: £820,000
| Supplier | Identifier | Award Value | Lots Won | Cross-References |
|---|---|---|---|---|
| X-FAB Sarawak Sdn. Bhd. | Procurement ID: PLGZ-1483-CXTX | £220,000 | 1 lot Lot LOT-0001 | - |
This procurement was divided into 1 lots, each awarded separately.
| Lot | Value | Awarded To | Status |
|---|---|---|---|
| Lot 1 | £220,000 initial term | X-FAB Sarawak Sdn. Bhd. | active |