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The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements.
| Supplier | Identifier | Award Value | Lots Won | Cross-References |
|---|---|---|---|---|
| S3 Alliance Ltd | NI065895 | - | 1 lot Scribe & Break | - |
This procurement was divided into 3 lots, each awarded separately. 2 bids were received in total.
| Lot | Value | Bids Received | Awarded To | Status |
|---|---|---|---|---|
| Lot 1 Saw Dicing 540 days (≈1.5 yrs) | - | - | - | active |
| Lot 2 Laser Dicing 540 days (≈1.5 yrs) | - | - | - | active |
| Lot 3 Scribe & Break 540 days (≈1.5 yrs) | £305,414 initial term | 2 | S3 Alliance Ltd | active |
Weightings from the notice, applied to every lot.
Published by the buyer on this notice. Check the original notice — details change and are not updated here.