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STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations. We have developed a process to perform surface preparation and make micro bumps of pure Indium metal, on a range of substrates including semiconductor wafers and semiconductor die.The resulting bumps are then used in our proprietary flip chip process to make many thousands or tens-of-thousands of electrical/mechanical connections in a single bonding step.The deposition process involves masking prior to deposition, then deposition, followed by removal of masked areas, leaving the desired bumps in place. Photo lithography (negative resist, lift-off) and shadow masking techniques are both used. We are now scaling this process into production and need new equipment capable of depositing on multiple substrates per day.
| Supplier | Identifier | Award Value | Lots Won | Cross-References |
|---|---|---|---|---|
| HHV Ltd | 06738557 | ~£320,000 estimated from lot values | 1 lot Lot 1 | - |
This procurement was divided into 1 lots, each awarded separately. 3 bids were received in total.
| Lot | Value | Bids Received | Awarded To | Status |
|---|---|---|---|---|
| Lot 1 360 days | £320,000 £185,067 initial term | 3 | HHV Ltd | active |
Weightings from the notice.
Government spending data: This supplier has received £1,687 in 1 payments (over £25k) from Guy's and St Thomas' NHS FT (2024-08-15 to 2024-08-15). View full payment history →
Published by the buyer on this notice. Check the original notice — details change and are not updated here.