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NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.
| Supplier | Identifier | Award Value | Lots Won | Cross-References |
|---|---|---|---|---|
| Accelonix | 03633364 | - | 1 lot Lot 1 | - |
This procurement was divided into 1 lots, each awarded separately. 1 bids were received in total.
| Lot | Value | Bids Received | Awarded To | Status |
|---|---|---|---|---|
| Lot 1 660 days (≈1.8 yrs) | £1,963,564 initial term | 1 single bid — no competition | Accelonix | active |
Weightings from the notice.
Government spending data: This supplier has received £198,761 in 34 payments (over £25k) from UKRI (2023-01-06 to 2023-06-01). View full payment history →
Published by the buyer on this notice. Check the original notice — details change and are not updated here.