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The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. The facility enables research, proof of concept and provides the capability to demonstrate the feasibility and undertake small volume prototype builds.
High-resolution X-ray equipment with CT scan capability is required the routine microelectronics assembly verification, optimisation of interconnect layers, finding buried defects and failure analysis for developing a reliable and quality integration process.
The estimated budget range for the contract is £300,000 - £400,000. The budget for the base system and additional tooling is expected to be a maximum of £300,000, with the estimated maximum value covering related future services and options.
The manufacturer/authorised vendor shall install the system at the Innovation Centre, CSA Catapult, by March 2021.
Additional information: To express interest in this opportunity and receive the procurement documents, please email …@csa.catapult.org.uk with the reference ICT-2020-041 in the subject field.
No supplier information available.