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The University of Leeds is seeking tenders for four dry etch and deposition systems, specifically:
â¢A Deep-Silicon Reactive Ion Etcher (D-RIE)
â¢An Inductively Coupled Plasma-RIE (ICP-RIE)
â¢A parallel plate RIE
â¢A High-Density Plasma-enhanced Chemical Vapour Deposition system (HDP-CVD)
No supplier information available.